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Thursday, 11 June 2015

Taking the heat off the chip_Global Thermal Interface Materials Report 2015 - Status, Opportunities, Market Forecasts to 2025 -- DUBLIN, June 5, 2015 /PRNewswire/ --


Here is a short rapid introduction and overview to a still hot topic-materials to markets 


"Overheating is the most critical issue in the computer industry. It limits further miniaturisation, power, performance and reliability. The escalation of power densities in electronic devices has made efficient heat removal a crucial issue for progress in information, communication, energy harvesting, energy storage and lighting technologies. As long as electronic systems aren't monolithic, but are built from a wide range of materials such as metals, polymers, ceramics and semiconductors, there will be a need for thermal interface materials." from PRNewswire


The contact area between high power, heat generating components and heat sinks can be as low as 3%, due to the micro-scale surface roughness. Thermal interface materials are required to enhance the contact between the surfaces, and decrease thermal interfacial resistance, and increase heat conduction across the interface. 

Proper selection of Thermal Interface Materials (TIM) is crucial for the device efficiency. Instead of sophisticated cooling technique, it is often better to invest in the interface material. Without good thermal contact, the use of expensive thermally conducting materials for the components is a waste. 


1. Innovation Drivers in this industry

2. Thermal Interface Materials 2015-2025 includes a technology appraisal of the ten key technologies: 


1. Pressure-Sensitive Adhesive Tapes
2. Thermal Adhesives
3. Thermal Greases
4. Thermal Gels, Pastes and Liquids
5. Elastomeric Pads
6. Phase Change Materials
7. Graphite
8. Solders and Phase Change Metals
9. Compressible Interface Materials
10. Liquid Metals 
3. Current and growing opportunities for these technologies

4. The Companies. 

- 3M Electronic Materials
- AI Technology
- AIM Specialty Materials
- AOS Thermal
- DK Thermal
- Dow Corning
- Dymax Corporation
- Ellsworth Adhesives
- Enerdyne
- European Thermodynamics Ltd
- Fralock
- Fujipoly
- GrafTech
- Henkel
- Indium Corporation
- Inkron
- Kitagawa Industries
- LORD
- Laird Tech
- MH&W International
- Minteq
- Momentive
- Parker Chomerics
- Resinlab
- Schlegel Electronics Materials
- ShinEtsu
- Timtronics
- Universal Science 


Global Thermal Interface Materials Report 2015 - Status, Opportunities, Market Forecasts to 2025 -- DUBLIN, June 5, 2015 /PRNewswire/ --:



LINK_for more information.



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